| APPLICATION PROCESSOR |
NXP® i.MX8QuadXPlus
- 4x Cortex®-A35 cores @ 1.2 GHz
- 1x Cortex-M4F @ 266 MHz core for real-time processing
- 1x Tensilica® Hi-Fi 4 DSP
|
NXP® i.MX8DualXZ
- 2x Cortex®-A35 cores @ 1.2 GHz
|
| MEMORY |
Up to 64 GB eMMC, up to 4 GB of LPDDR4 |
| PMIC |
NXP PF8100 |
| GRAPHICS |
Multi-stream-capable HD video engine with H.265 (4Kp30), H.264 (1080p60), VP6/VP8 (1080p60), MPEG-2 (1080p60), MPEG4 (1080p), RealVideo (1080p) decode and H.264 (1080p30) encode; 3D video playback in HD in high-performance families; Superior 3D graphics performance with up to four shaders |
H.264 (1080p60), VP6/VP8 (1080p60), MPEG-2 (1080p60), MPEG4 (1080p), RealVideo (1080p) decode and H.264 (1080p30) encode; 3D video playback in HD in high-performance families; Superior 3D graphics performance with up to four shaders |
| SECURITY |
Digi TrustFence®, TRNG, TrustZone, Ciphers, Security Cntrl, Secure RTC, Secure JTAG, eFuses (OTP) |
| PERIPHERALS/ INTERFACES** |
1x SD 3.0 card interface handles SD/SDIO/MMC protocols (1x additional one reserved on the SOM for supporting eMMC),
5x UARTs (4x UARTs from Cortex-A35 core, 1x UART from Cortex-M4), S/PDIF Tx/Rx,
8x I2 C (4xI2C high-speed DMA support 4x I2C low-speed no DMA support),
4x SPI, ESAI, 4x I2S/SSI, 3x FlexCAN, MLB150 + DTCP, USB 3.0 OTG with PHY, USB 2.0 OTG with PHY,
4x PWM, GPIO, Keypad, PCIe 3.0 (x1 lane)*, 2x MIPI DSI/LVDS, MIPI CSI, 8/10-bit CSI,
24-bit RGB, RTC, Watchdog, Timers, JTAG |
1x SD 3.0 card interface handles SD/SDIO/MMC protocols (1x additional one reserved on the SOM for supporting eMMC),
5x UARTs (4x UARTs from Cortex-A35 core, 1x UART from Cortex-M4), S/PDIF Tx/Rx,
8x I2 C (4xI2C high-speed DMA support 4x I2C low-speed no DMA support),
4x SPI, ESAI, 4x I2S/SSI, 3x FlexCAN, MLB150 + DTCP, USB 2.0 OTG with PHY,
4x PWM, GPIO, Keypad, PCIe 3.0 (x1 lane)*, 2x MIPI DSI/LVDS, MIPI CSI, 8/10-bit CSI,
24-bit RGB, RTC, Watchdog, Timers, JTAG |
| ETHERNET |
2x 10/100/1000M Ethernet + AVB |
| WI-FI |
802.11a/b/g/n/ac: 2.412 - 2.484 GHz, 4.900 - 5.850 GHz
802.11b: 1, 2, 5.5, 11 Mbps (17 dBm typical ±2 dBm)
802.11a/g: 6, 9, 12, 18, 24, 36, 48, 54 Mbps (15 dBm typical ±2 dBm)
802.11n: 15, 30, 45, 60, 90, 120, 135, 150 Mbps (12 dBm typical ±2 dBm) HT40, MCS 0-7
802.11ac: 15, 30, 45, 60, 90, 120, 135, 150, 180, 200 Mbps (10 dBm typical ±2 dBm) HT40, MCS 0-9
Note: all data rates provided above are for 1 spatial stream. For 2x spatial steams, double the data rate.
Security: WEP, WPA-PSK/WPA2-personal, WPA/WPA2-enterprise, 802.11i, Access Point Mode (up to 10 clients), Wi-Fi Direct
Industry certifications: Wi-Fi Alliance Logo Certification Ready, CCXv4 ASD Ready |
| BLUETOOTH |
Bluetooth® 5 |
| ON-MODULE MICROCONTROLLER ASSIST |
Digi Microcontroller Assist™
- Independent Cortex-M0+ microcontroller subsystem
- Supporting ultra-low power modes @ <3µA
|
| OPERATING TEMPERATURE |
Industrial: -40° C to 85° C (-40° F to 185° F) (depending on use case and enclosure/system design) |
| STORAGE TEMPERATURE |
-50° C to 125° C (-58° F to 257° F) |
| RELATIVE HUMIDITY |
5% to 90% (non-condensing) |
| RADIO APPROVALS |
US, Canada, EU, Japan, Australia/New Zealand |
| EMISSIONS/ IMMUNITY/ SAFETY |
FCC Part 15 Class B, EN 55022 Class B, EN 61000-3-2, EN 61000-3-3, ICES- 003 Class B, VCCI Class II, AS 3548,
FCC Part 15 Subpart C Section 15.247, IC (Industry Canada), RSS-210 Issue 5 Section 6.2.2(o), EN 300 328, EN 301 489-17, EN 55024, EN 301 489-3 |
| DESIGN VERIFICATION |
Temperature: IEC 60068-2-1, IEC 60068-2-2, IEC 60068-2-78
Vibration/Shock: IEC 60068-2-6, IEC 60068-2-64, IEC 60068-2-27, HALT |
| MECHANICAL DIMENSIONS |
118 castellated vias, LGA-474, 1.27 mm pitch, fully shielded for radio emissions and thermal management (heat-spreading) 40 mm x 45 mm x 3.5 mm |
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